Update STEP and render

Jetson-CAN.kicad_pcb

@@ -1,7 +1,7 @@
 (kicad_pcb (version 20221018) (generator pcbnew)
 
   (general
-    (thickness 1.6)
+    (thickness 1)
   )
 
   (paper "A4")
@@ -39,15 +39,15 @@
 
   (setup
     (stackup
-      (layer "F.SilkS" (type "Top Silk Screen"))
+      (layer "F.SilkS" (type "Top Silk Screen") (color "White"))
       (layer "F.Paste" (type "Top Solder Paste"))
-      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
+      (layer "F.Mask" (type "Top Solder Mask") (color "Purple") (thickness 0.01))
       (layer "F.Cu" (type "copper") (thickness 0.035))
-      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
+      (layer "dielectric 1" (type "core") (color "FR4 natural") (thickness 0.91) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
       (layer "B.Cu" (type "copper") (thickness 0.035))
-      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
+      (layer "B.Mask" (type "Bottom Solder Mask") (color "Purple") (thickness 0.01))
       (layer "B.Paste" (type "Bottom Solder Paste"))
-      (layer "B.SilkS" (type "Bottom Silk Screen"))
+      (layer "B.SilkS" (type "Bottom Silk Screen") (color "White"))
       (copper_finish "None")
       (dielectric_constraints no)
     )
@@ -263,10 +263,10 @@
       (net 2 "GND") (pinfunction "MountPin") (pintype "passive") (zone_connect 2) (tstamp d9a07481-4290-4b8b-8028-c51a615b13fa))
     (pad "MP" smd roundrect (at 1.8 1.875 256) (size 1.2 1.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2083333333)
       (net 2 "GND") (pinfunction "MountPin") (pintype "passive") (zone_connect 2) (tstamp 20e6e2aa-2c21-479d-a0f2-fd4a061b395a))
-    (model "${KICAD6_3DMODEL_DIR}/Connector_JST.3dshapes/JST_SH_SM02B-SRSS-TB_1x02-1MP_P1.00mm_Horizontal.wrl"
+    (model "${KIPRJMOD}/SM02B-SRSS-TB.STEP"
-      (offset (xyz 0 0 0))
+      (offset (xyz 0 1.25 -0.25))
       (scale (xyz 1 1 1))
-      (rotate (xyz 0 0 0))
+      (rotate (xyz -90 0 0))
     )
   )