(footprint "Baby_ST_Bond_Pad" (version 20221018) (generator pcbnew)
  (layer "F.Cu")
  (attr smd)
  (fp_text reference "REF**" (at 0 -0.5 unlocked) (layer "F.SilkS") hide
      (effects (font (size 1 1) (thickness 0.15)))
    (tstamp ca5f4cce-4a31-41de-a930-a7493dd9558b)
  )
  (fp_text value "Baby_ST_Bond_Pad" (at 0 1 unlocked) (layer "F.Fab") hide
      (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 4083a118-43dc-426a-8ba0-30edb80bd58c)
  )
  (pad "1" smd roundrect (at 0 0) (size 2.286 1.524) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.25)
    (thermal_bridge_angle 45) (tstamp 489159e8-228a-49ef-b8c9-9cc144e3f6f6))
)