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This commit is contained in:
Johnny Hsu
2024-02-29 12:24:06 +01:00
parent f253cd3842
commit 0047136424
1468 changed files with 1710252 additions and 1710203 deletions
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338
FT24-AMS_Slave/Gerber/FT24-AMS_Slave-v5-job.gbrjob
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@ -1,169 +1,169 @@
{
"Header": {
"GenerationSoftware": {
"Vendor": "KiCad",
"Application": "Pcbnew",
"Version": "7.0.6"
},
"CreationDate": "2024-02-05T21:22:57+01:00"
},
"GeneralSpecs": {
"ProjectId": {
"Name": "FT24-AMS_Slave-v5",
"GUID": "46543234-2d41-44d5-935f-536c6176652d",
"Revision": "rev?"
},
"Size": {
"X": 225.5118,
"Y": 70.71
},
"LayerNumber": 4,
"BoardThickness": 1.6,
"Finish": "None"
},
"DesignRules": [
{
"Layers": "Outer",
"PadToPad": 0.15,
"PadToTrack": 0.15,
"TrackToTrack": 0.2,
"MinLineWidth": 0.2,
"TrackToRegion": 0.2,
"RegionToRegion": 0.2
},
{
"Layers": "Inner",
"PadToPad": 0.15,
"PadToTrack": 0.15,
"TrackToTrack": 0.2,
"TrackToRegion": 0.5,
"RegionToRegion": 0.5
}
],
"FilesAttributes": [
{
"Path": "FT24-AMS_Slave-v5-F_Cu.gbr",
"FileFunction": "Copper,L1,Top",
"FilePolarity": "Positive"
},
{
"Path": "FT24-AMS_Slave-v5-In1_Cu.gbr",
"FileFunction": "Copper,L2,Inr",
"FilePolarity": "Positive"
},
{
"Path": "FT24-AMS_Slave-v5-In2_Cu.gbr",
"FileFunction": "Copper,L3,Inr",
"FilePolarity": "Positive"
},
{
"Path": "FT24-AMS_Slave-v5-B_Cu.gbr",
"FileFunction": "Copper,L4,Bot",
"FilePolarity": "Positive"
},
{
"Path": "FT24-AMS_Slave-v5-F_Paste.gbr",
"FileFunction": "SolderPaste,Top",
"FilePolarity": "Positive"
},
{
"Path": "FT24-AMS_Slave-v5-B_Paste.gbr",
"FileFunction": "SolderPaste,Bot",
"FilePolarity": "Positive"
},
{
"Path": "FT24-AMS_Slave-v5-F_Silkscreen.gbr",
"FileFunction": "Legend,Top",
"FilePolarity": "Positive"
},
{
"Path": "FT24-AMS_Slave-v5-B_Silkscreen.gbr",
"FileFunction": "Legend,Bot",
"FilePolarity": "Positive"
},
{
"Path": "FT24-AMS_Slave-v5-F_Mask.gbr",
"FileFunction": "SolderMask,Top",
"FilePolarity": "Negative"
},
{
"Path": "FT24-AMS_Slave-v5-B_Mask.gbr",
"FileFunction": "SolderMask,Bot",
"FilePolarity": "Negative"
},
{
"Path": "FT24-AMS_Slave-v5-Edge_Cuts.gbr",
"FileFunction": "Profile",
"FilePolarity": "Positive"
}
],
"MaterialStackup": [
{
"Type": "Legend",
"Name": "Top Silk Screen"
},
{
"Type": "SolderPaste",
"Name": "Top Solder Paste"
},
{
"Type": "SolderMask",
"Thickness": 0.01,
"Name": "Top Solder Mask"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "F.Cu"
},
{
"Type": "Dielectric",
"Thickness": 0.1,
"Material": "FR4",
"Name": "F.Cu/In1.Cu",
"Notes": "Type: dielectric layer 1 (from F.Cu to In1.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "In1.Cu"
},
{
"Type": "Dielectric",
"Thickness": 1.24,
"Material": "FR4",
"Name": "In1.Cu/In2.Cu",
"Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "In2.Cu"
},
{
"Type": "Dielectric",
"Thickness": 0.1,
"Material": "FR4",
"Name": "In2.Cu/B.Cu",
"Notes": "Type: dielectric layer 3 (from In2.Cu to B.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "B.Cu"
},
{
"Type": "SolderMask",
"Thickness": 0.01,
"Name": "Bottom Solder Mask"
},
{
"Type": "SolderPaste",
"Name": "Bottom Solder Paste"
},
{
"Type": "Legend",
"Name": "Bottom Silk Screen"
}
]
}
{
"Header": {
"GenerationSoftware": {
"Vendor": "KiCad",
"Application": "Pcbnew",
"Version": "7.0.6"
},
"CreationDate": "2024-02-05T21:22:57+01:00"
},
"GeneralSpecs": {
"ProjectId": {
"Name": "FT24-AMS_Slave-v5",
"GUID": "46543234-2d41-44d5-935f-536c6176652d",
"Revision": "rev?"
},
"Size": {
"X": 225.5118,
"Y": 70.71
},
"LayerNumber": 4,
"BoardThickness": 1.6,
"Finish": "None"
},
"DesignRules": [
{
"Layers": "Outer",
"PadToPad": 0.15,
"PadToTrack": 0.15,
"TrackToTrack": 0.2,
"MinLineWidth": 0.2,
"TrackToRegion": 0.2,
"RegionToRegion": 0.2
},
{
"Layers": "Inner",
"PadToPad": 0.15,
"PadToTrack": 0.15,
"TrackToTrack": 0.2,
"TrackToRegion": 0.5,
"RegionToRegion": 0.5
}
],
"FilesAttributes": [
{
"Path": "FT24-AMS_Slave-v5-F_Cu.gbr",
"FileFunction": "Copper,L1,Top",
"FilePolarity": "Positive"
},
{
"Path": "FT24-AMS_Slave-v5-In1_Cu.gbr",
"FileFunction": "Copper,L2,Inr",
"FilePolarity": "Positive"
},
{
"Path": "FT24-AMS_Slave-v5-In2_Cu.gbr",
"FileFunction": "Copper,L3,Inr",
"FilePolarity": "Positive"
},
{
"Path": "FT24-AMS_Slave-v5-B_Cu.gbr",
"FileFunction": "Copper,L4,Bot",
"FilePolarity": "Positive"
},
{
"Path": "FT24-AMS_Slave-v5-F_Paste.gbr",
"FileFunction": "SolderPaste,Top",
"FilePolarity": "Positive"
},
{
"Path": "FT24-AMS_Slave-v5-B_Paste.gbr",
"FileFunction": "SolderPaste,Bot",
"FilePolarity": "Positive"
},
{
"Path": "FT24-AMS_Slave-v5-F_Silkscreen.gbr",
"FileFunction": "Legend,Top",
"FilePolarity": "Positive"
},
{
"Path": "FT24-AMS_Slave-v5-B_Silkscreen.gbr",
"FileFunction": "Legend,Bot",
"FilePolarity": "Positive"
},
{
"Path": "FT24-AMS_Slave-v5-F_Mask.gbr",
"FileFunction": "SolderMask,Top",
"FilePolarity": "Negative"
},
{
"Path": "FT24-AMS_Slave-v5-B_Mask.gbr",
"FileFunction": "SolderMask,Bot",
"FilePolarity": "Negative"
},
{
"Path": "FT24-AMS_Slave-v5-Edge_Cuts.gbr",
"FileFunction": "Profile",
"FilePolarity": "Positive"
}
],
"MaterialStackup": [
{
"Type": "Legend",
"Name": "Top Silk Screen"
},
{
"Type": "SolderPaste",
"Name": "Top Solder Paste"
},
{
"Type": "SolderMask",
"Thickness": 0.01,
"Name": "Top Solder Mask"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "F.Cu"
},
{
"Type": "Dielectric",
"Thickness": 0.1,
"Material": "FR4",
"Name": "F.Cu/In1.Cu",
"Notes": "Type: dielectric layer 1 (from F.Cu to In1.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "In1.Cu"
},
{
"Type": "Dielectric",
"Thickness": 1.24,
"Material": "FR4",
"Name": "In1.Cu/In2.Cu",
"Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "In2.Cu"
},
{
"Type": "Dielectric",
"Thickness": 0.1,
"Material": "FR4",
"Name": "In2.Cu/B.Cu",
"Notes": "Type: dielectric layer 3 (from In2.Cu to B.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "B.Cu"
},
{
"Type": "SolderMask",
"Thickness": 0.01,
"Name": "Bottom Solder Mask"
},
{
"Type": "SolderPaste",
"Name": "Bottom Solder Paste"
},
{
"Type": "Legend",
"Name": "Bottom Silk Screen"
}
]
}